Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Product Status:
Active
Peripherals:
DMA, WDT
Primary Attributes:
-
Series:
Zynq® UltraScale+™
Package:
Tray
Mfr:
AMD
Supplier Device Package:
625-FCBGA (21x21)
Connectivity:
-
Operating Temperature:
0°C ~ 100°C (TJ)
Architecture:
MPU, FPGA
Package / Case:
625-BFBGA, FCBGA
Number Of I/O:
-
RAM Size:
256KB
Speed:
533MHz, 1.333GHz
Core Processor:
Dual ARM® Cortex®-A53 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5 With CoreSight™
Flash Size:
-
Payment & Shipping Terms
Stock
In Stock
Shipping Method
LCL, AIR, FCL, Express
Description
IC ZUP MPSOC LP A53 FPGA 625BGA
Payment Terms
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Product Description
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ 533MHz, 1.333GHz 625-FCBGA (21x21)
